Products

ARALDITE® 2014 A/B is a two-component, room temperature curing, thixotropic paste adhesive with high strength and excellent chemical resistance. It is used for bonding metals, electronic components, GRP structures, and many other items exposed to higher than normal temperatures or more aggressive environments. Its low outgassing makes it suitable for specialist electronic telecommunications and aerospace applications.

ARALDITE® 8680 / HARDENER 5868 is a two-part, black system specifically formulated for bonding plastics, including polycarbonate, ABS, nylon, and Telene®, as well as painted metals. It features excellent environmental stability and impact resistance.

ARALDITE® AW 8621 / HARDENER HW 8621-3 is a two-part, black system specifically formulated for bonding plastics, including polycarbonate, ABS, nylon, and Telene®, as well as painted metals. It is also used for potting automotive light socket connectors. It features excellent environmental and impact resistance.

ARALDITE® AW 8680 / HARDENER HW 5542 is a two-part, rapid-curing system specifically formulated for bonding plastics, including polycarbonate, ABS, nylon, and Metton® with minimal substrate preparation. ARALDITE® AW 8680 / HARDENER HW 5542 has also been used successfully for bonding materials with differing CTEs, such as nylon to stainless steel. Once cured, it features good environmental stability and impact resistance.

PHENOXY™ LER-HB is a 100% NV liquid Bisphenol A-type epoxy resin modified with 10% PHENOXY™ PKHB. It combines the reactivity of liquid epoxy with the toughness of PHENOXY™ resin, ideal for composites, coatings, inks, and adhesives. It can be further modified with other epoxy resins, reactive diluents, and solvents. When cured with latent hardeners like dicyandiamide, it improves toughness and adhesion on substrates like steel, aluminum, glass, carbon fibers, and plastics.

PHENOXY™ PKFE is a high-viscosity phenoxy resin known for its toughness, ductility, and excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics. It can be used in single-pack epoxies with latent hardeners like dicyandiamide to improve toughness and adhesion. PHENOXY™ PKFE is soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHA is a low-viscosity phenoxy resin known for its toughness, ductility, and excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins to enhance chemical resistance, hardness, and adhesion on substrates such as steel, aluminum, glass, carbon fibers, and plastics like nylon and PET. PHENOXY™ PKHA can also be used in single-pack epoxies with latent hardeners like dicyandiamide for improved toughness and adhesion. It is soluble in many polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHB+ is a low-viscosity phenoxy resin offering excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance and adhesion to materials like steel, aluminum, glass, and plastics. Used in single-pack epoxies with latent hardeners like dicyandiamide, it improves toughness and adhesion. Soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHJ is a high-viscosity phenoxy resin known for its excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins, offering strong chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics such as nylon and PET. PHENOXY™ PKHJ can be used in single-pack epoxies with latent hardeners like dicyandiamide to improve toughness and adhesion. It is soluble in polar, aprotic solvents like MEK, cyclohexanone, and glycol ethers.

PHENOXY™ PKHM 301 is a solid-grade phenoxy resin blended with an oligomeric polyester polyol. It offers excellent thermal stability, adhesive strength, and chemical resistance. With a low glass transition temperature (~35°C), it improves reactivity and viscosity in solvents like MEK. When cured, it provides flexible, formable coatings with strong adhesion to various substrates, including steel, aluminum, and plastics.

PHENOXY™ PKHS 25 M is a 25% NV solution of PHENOXY™ PKHC resin in Propylene Glycol Methyl Ether Acetate (PMA). This resin offers excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics such as nylon and PET. PKHS 25M can be thinned with additional PMA, MEK, xylene, or toluene to adjust viscosity. When cured, coatings provide excellent flexibility and toughness.

PHENOXY™ PKHS 27 is a 27% NV solution of acid-modified phenoxy resin in methyl ethyl ketone (MEK). This tough, ductile resin offers excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked through its hydroxyl groups with isocyanates, melamine, or phenolic resins, and its carboxylic acid groups can be crosslinked with poly(carbodiimides), poly(aziridines), or epoxy agents. Crosslinked PHENOXY™ PKHS-27 exhibits excellent chemical resistance, toughness, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fiber, and thermoplastics such as nylon and polyester.

PHENOXY™ PKHS 30 PMA is a 30% NV solution of PHENOXY™ resin in Propylene Glycol Methyl Ether Acetate (PMA). This tough, ductile resin offers excellent thermal stability, adhesive strength, and vapor barrier properties. It can be crosslinked through its hydroxyl groups with isocyanates, melamine, or phenolic resins, providing excellent chemical resistance, hardness, and adhesion to substrates like steel, aluminum, glass, carbon fibers, and plastics such as nylon and polyester (PET).

PHENOXY™ PKHS 40 is a 40% solution of PHENOXY resin in methyl ethyl ketone (MEK). It offers excellent thermal stability, adhesive strength, and can be crosslinked with isocyanates, melamine, or phenolic resins for enhanced chemical resistance, hardness, and adhesion to various substrates.

PHENOXY™ PKHW 35 is a waterborne colloidal dispersion of Phenoxy resin for thermoset coatings and adhesives. It offers excellent thermal stability, adhesive strength, and vapor barrier properties. Crosslinked with isocyanates, melamine, or phenolic resins, it enhances chemical resistance and adhesion. Compatible with most waterborne polyurethanes and acrylics, it improves film hardness, dry-to-touch times, and gloss. Crosslinkers like isocyanates and epoxy silanes further enhance physical properties. Coatings exhibit excellent flexibility and surface hardness.