Products

ARALDITE® MY 721 MBC is a liquid monomer used in adhesives, sealants, and industrial applications. It functions as a monomer in various industrial processes, ensuring effective performance in bonding and sealing tasks.

ARALDITE® S6440-05 is a liquid adhesive and sealant used in industrial applications, including equipment and parts bonding. It provides reliable performance for various sealing and bonding processes in industrial settings.

ARALDITE® 403 A/B is a two-pack cold-curing structural adhesive system developed primarily for use in riveted joints to provide improved fatigue resistance. It also offers the benefits of bonded assembly for structural joints that cannot be bonded with hot-cured adhesives due to their size or other physical limitations. It is also suitable for honeycomb-to-skin bonding.

ARALDITE® Wear Coat 8581 A/B is a two-part compound filled with microsized ceramic beads. It is designed for rebuilding worn parts or adding a protective lining to part surfaces that will be exposed to abrasive or corrosive slurries. It is a toughened, impact-resistant compound that features outstanding chemical and abrasion resistance.

ARALDITE® 5865 A/B epoxy adhesive is a two-component, room temperature curing paste that exhibits high strength and toughness. The product is thixotropic and features good chemical resistance for use in harsh/aggressive environments. ARALDITE® 5865 A/B epoxy adhesive is suitable for bonding electrical components, insulation sheets, and other parts requiring elevated temperature performance.

ARALDITE® AW 2101 / HARDENER HW 2951 is a rapid cure, multipurpose, two-component, room temperature curing industrial paste adhesive of high strength and toughness. It is suitable for bonding a wide variety of metals, ceramics, glass, rubber, rigid plastics, and many other materials in common use.

ARALDITE® AW4858 / Hardener HW4858 is a two-component epoxy adhesive system with very high lap shear and peel strength. It bonds a wide variety of materials, including metal, composite, and thermoplastics. The adhesive offers good moisture resistance, extreme toughness, and resilience, with a long pot life, making it ideal for large composite part assemblies.

ARALDITE® 1644 A/B is a very low-density, room-temperature curing epoxy syntactic designed for edge sealing, void, and gap filling of honeycomb structures. The core filler is characterized by its combination of low density and high compressive strength.

ARALDITE® 2018 A/B is a two-component, room temperature curing, pale-colored, lightly thixotropic liquid polyurethane adhesive for thermoplastic bonding.

ARALDITE® 2047-1 A/B is a cold curing two-part methacrylate adhesive for metal and plastic bonding. Depending on the method of processing, ARALDITE® 2047-1 A/B fills joints up to a gap width of approximately 5mm. With many bonds, an expensive pretreatment of the parts to be joined is not necessary, or can be reduced to a minimum. The adhesive can be processed at temperatures up to 40°C. Higher temperatures shorten the setting time.

ARALDITE® 3113 is a liquid resin from the chemical mixtures and blends family, listed in California Prop 65. It is suitable for adhesives and sealants, as well as industrial markets, particularly in adhesives and sealants technologies.

ARALDITE® 8579 is a liquid epoxy adhesive from the chemical mixtures and blends family. It is ideal for adhesives and sealants markets, particularly in industrial applications, focusing on thermosetting adhesives and sealants technologies.

ARALDITE® AV 8 is a multipurpose, one-component viscous adhesive that cures at temperatures above 120°C. It offers high strength and toughness and is suitable for bonding a wide variety of metals and most other materials in industrial applications.

ARALDITE® AW 1315 is a liquid epoxy adhesive from the chemical mixtures and blends family, insoluble in water. It is suitable for adhesives and sealants markets, particularly in industrial applications, focusing on thermosetting adhesives and sealants technologies.

ARALDITE® CW 2245 N is a liquid resin designed for encapsulation and industrial additive functions. It is ideal for battery and electronic materials technologies, particularly in electrical and electronics markets.