Products

EPOCAST® 50-A1/946 laminating system is an unfilled, solvent-free, easy-to-handle material for the manufacture or repair of composite structures as well as for filament winding. EPOCAST® 50-A1 Resin / Hardener 946 epoxy laminating system is flame-retardant and is qualified to BMS 8-201, Type IV, Rev. F. This product is also available in a longer work-life version - EPOCAST® 50-A1 Resin / Hardener 9816 epoxy laminating system.

EPOCAST® 50-A1/9816 is an unfilled, solvent-free, easy-to-handle material for the manufacture or repair of composite structures as well as for filament winding. EPOCAST® 50-A1 Resin / Hardener 9816 epoxy laminating system is flame-retardant. EPOCAST® 50-A1 / Hardener 9816 is qualified to BMS 8-201, Type III, Rev. F. This product is also available in a shorter work-life version - EPOCAST® 50-A1 Resin / Hardener 946 epoxy laminating system.

EPOCAST® 52-A/B is a two-part material formulated for service up to 350°F (177°C). Well suited for fabrication and repair of graphite composites, the laminating system combines low-temperature vacuum bag curing capability with good hot-wet strength. EPOCAST® 52-A/B epoxy laminating system is qualified to specifications including AIMS 08-01-002-01; AIMS 08-02-002-01; and SAE AMS2980.

EPOCAST® 54-A/B laminating system is an unfilled, solvent-free, easy-to-handle product. It is self-extinguishing and well-suited for the manufacture and repair of composite structures. In addition to laminating applications, the epoxy system can be used for filament winding. EPOCAST® 54-A/B epoxy laminating system is qualified to AIMS 04-27-000-01.

EPOCAST® 88103-A/B casting system is a two-component material that cures at a low temperature. It is formulated to yield a cured polymer with good mechanical, optical, and electrical properties. EPOCAST® 88103-A/B casting system is formulated specifically for the encapsulation of light-emitting diodes. The product is suitable for use in applications that require the environmental protection properties of an epoxy combined with high-efficiency visible light transmission. EPOCAST® 88103-A/B casting system is also widely used as an optical electronic packaging (encapsulant) material.

EPOCAST® 89537-A/B epoxy syntactic is a two-part system with glass-fiber reinforcement that can be troweled or extruded into honeycomb core structures for fastener and attachment potting, core splicing, and edge reinforcing. The syntactic has a non-sag consistency that allows for vertical application up to ½-inch (1.25 cm) thick. EPOCAST® 89537 A/B epoxy syntactic is self-extinguishing and meets the requirements of BMS 5-28 Type 32.

EPOCAST® 938-A3 Epoxy Structural Syntactic Adhesive is a frozen, one-component, flame-retardant compound designed for reinforcing honeycomb structures. EPOCAST® 938-A3 Epoxy Syntactic features high compressive strength at 350°F (177°C). Once thawed, EPOCAST® 938-A3 Syntactic is a thixotropic paste that can be easily dispensed from the cartridge using suitable pneumatic dispensing equipment. EPOCAST® 938-A3 Syntactic is qualified to BMS5-21, Type 1 classes 1; SMS 116201, Type 2; RMS 027, Type X; and others.

EPOXY SEAL / EPOXY SEAL HARDENER-1 comprises an epoxy resin and its hardener is based on reactive nitrile rubber and polyamine. The system is widely used as a waterproofing membrane or sealant for shower basins and as expansion joints in concrete.

ERISYS® GE-10 CI, epoxidized ortho cresol, is a low-viscosity, aromatic mono-epoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE-10 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.

ERISYS® GE 10 EX is an epoxidized ortho cresol used as a reactive diluent for high-viscosity epoxy resins. It provides minimal change to the performance properties of diluted formulations, reduces crystallization, and is ideal for environmentally challenging applications like floor coatings and concrete repair.

ERISYS® GE 11, epoxidized para-tertiary butyl phenol, is an aromatic mono-epoxide. GE-11 is intended for use as a reactive diluent for high-viscosity epoxy resins and is compatible at all concentrations with those resins. Resin/diluent blends can be cured using any curing agent for epoxy resins.

ERISYS® GE 12 is a liquid processing additive used in industrial applications. It is slightly soluble in water, providing effective performance in various processes that require specific properties for industrial use.

ERISYS® GE 20 reactive diluent is an epoxidized neopentyl glycol, a low-viscosity, aliphatic diepoxide. It is designed as a reactive diluent for high-viscosity epoxy resins, compatible at all concentrations, and can be cured with any epoxy resin curing agent.

ERISYS® GE 21 epoxidized butanediol is a low-viscosity, aliphatic diepoxide used as a reactive diluent for high-viscosity epoxy resins. It is compatible at all concentrations and can be cured with any epoxy resin curing agent.

ERISYS® GE 22 CI, epoxidized cyclohexanedimethanol, is a low-viscosity, cycloaliphatic diepoxide. It is intended for use as a reactive diluent for high-viscosity epoxy resins. ERISYS® GE 22 CI is compatible at all concentrations with these resins, and resin/diluent blends can be cured using any epoxy resin curing agent.