Products

ELASTAMINE® RT-1000 polyetheramine is a polyether diamine. It is liquid at room temperature and easy to use. The terminal amino group of polyetheramine products has good activity, which makes it suitable for the modification of various polymers, such as the polycondensation reaction of polyamide (nylon) synthesis. By introducing polyetheramine into the polymer backbone, the modified product has better flexibility and low temperature performance.

EPALLOY® 5001 N Resin is a hydrogenated bisphenol-A epoxy resin with improved chalking resistance and gloss retention to achieve optimal weathering resistance. Formulations based on EPALLOY® 5001 N Resin show improved cure speeds of up to 50% compared to the standard epoxidized hydrogenated bisphenol-A, EPALLOY® 5000 Resin. EPALLOY® 5001 N Resin shows improved adhesion and hardness development while maintaining low yellowing and excellent UV resistance. It contains no unsaturation or aromatic structures, providing excellent resistance to outdoor weathering. Cycloaliphatic amines are the recommended curing agents to achieve optimum weathering resistance, while aromatic compounds or acids should be avoided as they may reduce UV resistance.

EPALLOY® 5200 Resin is a difunctional cycloaliphatic glycidyl ester based on hexahydrophthalic anhydride. It is a low-viscosity resin primarily designed for use with anhydride curing agents in electrical insulation applications. Because it is fully aliphatic, it is well-suited to withstand sun and UV exposure in outdoor use. When cured with accelerated anhydride curing agents, glass transition temperatures in excess of 110°C can be attained.

EPALLOY® 7190S is a liquid chemical mixture used in various industrial applications.

EPALLOY® 7192 N is an unmodified, high-molecular-weight bisphenol-A-based epoxy resin that is a semisolid material at room temperature. It is particularly well-suited for use in formulating durable high-solids coatings, toughened adhesives, laminating resins, and prepreg molding compounds. Compared to lower-molecular-weight epoxy resins, it provides faster cure, improved adhesion, more durable cured systems, and enhanced toughness, though with somewhat reduced high-temperature performance.

EPALLOY® 8220 is a low-viscosity, epoxidized bisphenol-F resin that provides low hydrolyzable chloride content, a high degree of reactivity, and outstanding chemical resistance. EPALLOY® 8220 resin contains no diluent and is compatible with all standard curatives and most resin systems and solvents.

EPALLOY® 8225 is a liquid formaldehyde-phenol-epichlorohydrin copolymer used in various industrial applications.

EPALLOY® 8250 CI exhibits a very low room temperature viscosity. Close process control produces a resin significantly lower in viscosity than other commercially available epoxy novolacs of similar functionality. EPALLOY® 8250 CI combines low hydrolyzable chlorides with good reactivity. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. Because of its low viscosity, EPALLOY® 8250 CI is an excellent resin for formulating 100% solids coatings and trowelable flooring. Those formulations will cure at room temperature and provide chemical resistance to concentrated acids and aggressive solvents. EPALLOY® 8250 CI is also the preferred resin for use in electronic encapsulation, laminating and film adhesives.

EPALLOY® 9000 is a 3.0-functional epoxy resin based on tris-hydroxyphenyl ethane, exhibiting very low melt viscosity. It is designed for applications requiring high-temperature performance. At room temperature, EPALLOY® 9000 is a clear glass, which becomes a viscous liquid at mildly elevated temperatures, making it suitable for bonding, coating, sealing, and filling applications. Its high functionality and aromatic character produce very hard cured compositions with excellent thermal and chemical resistance. Additionally, EPALLOY® 9000 can enhance tensile, flexural, and compressive strength in epoxy formulations.

EPIBOND® 104 A-1/B is a two-part, cream-colored, non-flowing paste designed for bonding metals, plastics, concrete, and rubber. Its viscosity provides good gap-filling properties, making it suitable for vertical surfaces. Applications include honeycomb edge sealing, concrete patching, rigid foam sealant, vibration dampers, and press pads. Available in different work-life versions, it also includes the EPIBOND® 104A-1 resin/Hardener 946 epoxy adhesive.

EPOCAST® 1638-1 A/B epoxy syntactic adhesive is a low-density compound designed for potting fasteners in honeycomb structures. EPOCAST® 1638-1 A/B epoxy syntactic meets FAR 25.853 60-second vertical ignition requirements. EPOCAST® 1638-1 A/B is easily extruded through a 1/8 in (3 mm) nozzle orifice, but is non-flowing after application. EPOCAST® 1638-1 A/B epoxy syntactic adhesive sets quickly at room temperature. It does not contain halogenated fire retardant additives nor antimony trioxide.

EPOCAST® 35 A/927 epoxy laminating system is a two-component, solvent-free material designed to perform at temperatures up to 300ºF (149°C). The medium-viscosity liquid laminating system readily wets glass fabrics; its long work life supports extended fabrication times for large composite repairs. EPOCAST® 35 A/927 epoxy laminating system is well-suited for repair or fabrication of laminated composite structures and other applications requiring good high-temperature properties. This system is qualified to BMS 8-214.

EPOCAST® 42 B is a liquid resin designed for aerospace and aviation, electrical and electronics, and equipment and parts applications. It is used in electronics manufacturing and serves as an industrial additive for electrical components, electronics, and optical applications. It is water-soluble for ease of use.

EPOCAST® 50-A1/946 laminating system is an unfilled, solvent-free, easy-to-handle material for the manufacture or repair of composite structures as well as for filament winding. EPOCAST® 50-A1 Resin / Hardener 946 epoxy laminating system is flame-retardant and is qualified to BMS 8-201, Type IV, Rev. F. This product is also available in a longer work-life version - EPOCAST® 50-A1 Resin / Hardener 9816 epoxy laminating system.

EPOCAST® 50-A1/9816 is an unfilled, solvent-free, easy-to-handle material for the manufacture or repair of composite structures as well as for filament winding. EPOCAST® 50-A1 Resin / Hardener 9816 epoxy laminating system is flame-retardant. EPOCAST® 50-A1 / Hardener 9816 is qualified to BMS 8-201, Type III, Rev. F. This product is also available in a shorter work-life version - EPOCAST® 50-A1 Resin / Hardener 946 epoxy laminating system.