Products

EPOCAST® 52-A/B is a two-part material formulated for service up to 350°F (177°C). Well suited for fabrication and repair of graphite composites, the laminating system combines low-temperature vacuum bag curing capability with good hot-wet strength. EPOCAST® 52-A/B epoxy laminating system is qualified to specifications including AIMS 08-01-002-01; AIMS 08-02-002-01; and SAE AMS2980.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPOCAST® 54-A/B laminating system is an unfilled, solvent-free, easy-to-handle product. It is self-extinguishing and well-suited for the manufacture and repair of composite structures. In addition to laminating applications, the epoxy system can be used for filament winding. EPOCAST® 54-A/B epoxy laminating system is qualified to AIMS 04-27-000-01.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPOCAST® 88103-A/B casting system is a two-component material that cures at a low temperature. It is formulated to yield a cured polymer with good mechanical, optical, and electrical properties. EPOCAST® 88103-A/B casting system is formulated specifically for the encapsulation of light-emitting diodes. The product is suitable for use in applications that require the environmental protection properties of an epoxy combined with high-efficiency visible light transmission. EPOCAST® 88103-A/B casting system is also widely used as an optical electronic packaging (encapsulant) material.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

EPOCAST® 89537-A/B epoxy syntactic is a two-part system with glass-fiber reinforcement that can be troweled or extruded into honeycomb core structures for fastener and attachment potting, core splicing, and edge reinforcing. The syntactic has a non-sag consistency that allows for vertical application up to ½-inch (1.25 cm) thick. EPOCAST® 89537 A/B epoxy syntactic is self-extinguishing and meets the requirements of BMS 5-28 Type 32.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

Epoxy Curing Agent ECA 29 is a mixture of aliphatic polyamines derived from ethylenediamine and has an AHEW (amine-hydrogen equivalent weight) in the range of 36-38. Consisting of higher oligomers of TETA (triethylenetetramine), Epoxy Curing Agent ECA 29 amine may be particularly useful as an epoxy curing agent in applications where higher Tg (glass transition temperature) and reasonably fast reactivity are needed with longer pot-life than DETA or TETA hardeners. As illustrated by the following figure, the increasingly fast gel times with standard bisphenol A based epoxies of the ethyleneamine series EDA (AHEW = 15.03), DETA (AHEW = 20.6), and TETA (AHEW = 24.4) are attributable to their increasing functionality and to them being aliphatic amines. For these three amines, the gel times shorten through the series, even though their AHEWs are increasing, which decreases the concentration of reactants in stoichiometric mixtures. As might be expected, the amines with higher AHEW, and therefore lower amine group concentrations in the formulations, have somewhat lower maximum exotherm temperatures. Epoxy Curing Agent ECA 29 amine follows this trend of having a slightly lower exotherm temperature, however it provides a longer working time until gelation than do the lower functionality amines DETA or TETA. This is attributed to the higher proportion of secondary amino groups in this product. The high functionality of this amine also increases the level of crosslinking in the fully cured epoxy, resulting in a relatively high Tg of 143°C.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

Ethylene Diamine (EDA) is the lowest molecular weight ethyleneamine. It contains two primary nitrogens. EDA is a singlecomponent product that is clear and colorless, with an ammonia-like odor.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

Flexibiliser DY 965 is recommended for the preparation of high-impact-resistant epoxy resin compositions. It is useful for making adhesives and binders for cathodic electrodeposition primers and is suitable for the preparation of dust-free electronic prepregs, as well as special binder systems made by the advancement process.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HARDENER 959 is a liquid aliphatic polyamine epoxy curing agent used in the aerospace and aviation, industrial, and paints and coatings markets. It features chemical resistance, high hardness, and low viscosity. This product functions as a hardener for composite materials, industrial additives, and plastics and elastomers. It is soluble in water, ensuring effective application in various formulations.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RA 1340 is a high-viscosity adduct of diglycidyl ether of bisphenol A (DGEBA) and butadiene-acrylonitrile (CTBN) elastomer. It enhances toughness, impact resistance, thermal shock, and peel resistance in epoxy formulations, with minimal reduction in thermal resistance and modulus. Compatible with standard epoxy resins and curing agents.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RA840 is a high-viscosity adduct of the diglycidyl ether of bisphenol A (DGEBA) and a butadiene-acrylonitrile (CTBN) elastomer. The elastomer improves the toughness and impact, thermal shock and peel resistance of the epoxy formulation. These improvements are attained with little loss of thermal resistance and modulus. HYPOX® RA840 adduct is suggested for use as a toughener in fiber-reinforced products, adhesives, molding compounds, potting and encapsulating compounds and chemical-resistant coatings. HYPOX® RA840 adduct can be blended with other bis-A epoxy resins to achieve the degree of toughening required.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RA 95 N Resin is a high-viscosity, bisphenol-A epoxy resin toughened with butadiene-acrylonitrile (CTBN) elastomer. It combines epoxy functionality with improved toughness and impact resistance, offering higher temperature performance and better green strength compared to liquid CTBN-based epoxies. Ideal for film adhesives, it provides greater creep resistance at elevated temperatures and is compatible with most standard epoxy resins and curing agents. Cure speed is similar to that of standard liquid bisphenol-A epoxies.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RF 928 N Adduct is an epoxy phenol novolac resin toughened with a CTBN (carboxyl-terminated butadiene-acrylonitrile) co-polymer. With a low viscosity, a functionality of 2.3, and 20% elastomer content, it enhances toughness without significantly affecting Tg. Formulations with this adduct show improved impact, thermal cycling, peel, tensile shear strengths, and low-temperature properties. It also offers better chemical and heat resistance than DGEBA-toughened epoxies at the same rubber level.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RK 820 is an adduct of solid bis-A epoxy resin toughened with CTBN, designed for powder coatings. It can be used as the sole epoxy resin or as a modifier to enhance impact tolerance, toughness, and adhesion to pipe. With 20% CTBN content, it is also suitable for adhesives, laminates, and solvent-based coatings.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RM20 is an adduct of CTBN with epoxidized neopentyl glycol. Compared to standard epoxy resin/CTBN adducts, this product has a lower viscosity coupled with a high rubber content and is intended for use in combination with standard epoxy resins when the end-use application requires toughening and lower viscosity. HYPOX® RM20 adduct will increase flexibility, crack resistance, fatigue resistance, peel resistance, and adhesive properties. It will also improve the cathodic disbondment property when used in coating formulations for underground buried pipes in oil and gas transport applications.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

HYPOX® RM22 is an adduct of CTBN with epoxidized cyclohexane dimethanol. Compared to standard epoxy resin/CTBN adducts, the product exhibits a moderate viscosity, coupled with a high rubber content. HYPOX® RM22 adduct is intended for use in combination with standard epoxy resins when the end-use application requires toughening and improved rubber compatibility with DGEBA. HYPOX® RM22 adduct will increase flexibility, crack, fatigue, and peel resistance, and adhesive properties. It will also improve the cathodic disbondment property when used in coating formulations for underground buried pipes in oil and gas transport applications.

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.