Products

EPOCAST® 1633-A40/B is a liquid thermosetting adhesive and sealant used in aerospace and aviation applications. It is HAPs-free and slightly soluble in water, providing reliable performance in demanding environments.

EPOCAST® 1633-A41/B is a flame-retardant, low-density paste used in aerospace and aviation applications. It is ideal for aircraft interiors, honeycomb structures, and lockers. Slightly soluble in water, it delivers high performance in demanding applications.

EPOCAST® 1633-A50/B is a paste used in aerospace and aviation applications. This thermosetting adhesive and sealant is slightly soluble in water, offering reliable performance in various demanding environments.

EPOCAST® 1635-A/B epoxy syntactic is a two-component, high-performance material designed for refilling mis-drilled holes in composite parts. This aluminum-filled, high-viscosity system exhibits outstanding compressive strength and dynamic fatigue resistance under load at elevated temperatures. This product is qualified to BMS 5-28, Type 31.

EPOCAST® 1636-A/B epoxy syntactic is a high-performance, two-part system with high strength and good high-temperature resistance. The aluminum-filled, medium-viscosity epoxy compound is easy to handle and machines easily in the cured state. EPOCAST® 1636-A/B epoxy syntactic is used to reinforce honeycomb structures and is qualified to BMS 5-28, Type 6.

EPOCAST® 1638-1 A/B epoxy syntactic adhesive is a low-density compound designed for potting fasteners in honeycomb structures. EPOCAST® 1638-1 A/B epoxy syntactic meets FAR 25.853 60-second vertical ignition requirements. EPOCAST® 1638-1 A/B is easily extruded through a 1/8 in (3 mm) nozzle orifice, but is non-flowing after application. EPOCAST® 1638-1 A/B epoxy syntactic adhesive sets quickly at room temperature. It does not contain halogenated fire retardant additives nor antimony trioxide.

EPOCAST® 1645 A/B is a two-component, ultra-low-density, flame-retardant epoxy void filler designed for edge filling/reinforcing of honeycomb structures used in aerospace interior applications. Both Epocast® 1645 FR A and B are non-sticky, very soft pastes which can be easily mixed and applied manually and are water-cleanable after application. EPOCAST® 1645 A/B sets quickly at room temperature and is sandable shortly after application. It is well-suited for aerospace applications requiring low density, high strength, and rapid component assembly.

EPOCAST® 1648 A/B is a two-component, low-density, flame-retardant syntactic adhesive that can be easily extruded through a 1/8 in. (3mm) nozzle orifice and is non-flowing after application. EPOCAST® 1648 A/B Adhesive can be applied using mix metering dispensing equipment, Semco™ cartridges, or by hand mixing. It sets quickly at room temperature and is qualified to BMS 5-28, Type 18, Class 1. EPOCAST® 1648 A/B Adhesive does not contain any SVHC (substance of very high concern) as defined under REACH.

EPOCAST® 1649-1 A/B is a two-component, low-density, fast-cure, FST-rated epoxy adhesive and void filler designed for insert potting, ditch potting, and edge filling/reinforcing of honeycomb structures used in aerospace interior applications. Both EPOCAST® 1649-1 A/B are very soft pastes, which can be easily mixed and applied manually or by dual cartridge with static mixer. EPOCAST® 1649-1 A/B sets very quickly at room temperature and can be sanded shortly after application. It is well-suited for aerospace applications requiring low density, high strength, and rapid component assembly.

EPOCAST® 1652-A/B is a low-density system with good elevated temperature performance after a room-temperature cure. The epoxy syntactic is suitable for core filling metal skins, adding stiffness and strength to fabricated parts such as helicopter rotor blades, core splicing, and strengthening radii and corners of reinforced plastic structures. EPOCAST® 1652-A/B is qualified to Grumman GM 4006, Gulfstream GMS 4005, and Sikorsky 9587, Type 2.

EPOCAST® 1656-A/B epoxy syntactic is a low-density compound with good elevated temperature properties after a room-temperature cure. The epoxy syntactic is useful as a core fill for metal skins to add stiffness and strength to fabricated parts and is also suitable for core splicing and strengthening radii and corners of reinforced plastic structures. EPOCAST® epoxy syntactic meets requirements of GM-4006-1-2.

EPOCAST® 169 A-1/946 is a two-component, low-density, pourable epoxy system that cures at room temperature to a carvable, wood-like product. This epoxy syntactic system has good dimensional stability under changing humidity conditions. EPOCAST® 169 A-1/946 system is easy to use and is suitable for core filling and reinforcing honeycomb panels. It is qualified to SS-9587, Type 1.

EPOCAST® 169 A-1/9615 is a two-component, low-density epoxy syntactic that cures at room temperature to a carvable, wood-like product. The cured EPOCAST® 169 A-1/9615 system has good dimensional stability under changing humidity conditions. EPOCAST® 169 A-1/9615 is qualified to SS-9587, Type 1.

EPOCAST® 35 A/927 epoxy laminating system is a two-component, solvent-free material designed to perform at temperatures up to 300ºF (149°C). The medium-viscosity liquid laminating system readily wets glass fabrics; its long work life supports extended fabrication times for large composite repairs. EPOCAST® 35 A/927 epoxy laminating system is well-suited for repair or fabrication of laminated composite structures and other applications requiring good high-temperature properties. This system is qualified to BMS 8-214.

EPOCAST® 42 B is a liquid resin designed for aerospace and aviation, electrical and electronics, and equipment and parts applications. It is used in electronics manufacturing and serves as an industrial additive for electrical components, electronics, and optical applications. It is water-soluble for ease of use.