Products

RENLAM® LY 113 / REN® HY 98 is a low-viscosity laminating system with good thermal performance

RenLam® LY 120 is a low-viscosity epoxy resin Ren® HY 99 is a cycloaliphatic polyamine

RENLAM® LY 1918 / REN® HY 5161-1 is a liquid, ready-to-use resin designed for tooling and moldmaking applications. It offers low viscosity, non-stick properties, and room temperature curing, making it ideal for efficient moldmaking processes.

RENLAM® LY 5138-2 / REN® HY 5138 is a liquid, ready-to-use resin designed for tooling and moldmaking applications. It offers good thermal stability, long potlife, low color formation, low viscosity, and a non-tacky surface, ensuring reliable performance and high-quality results in various moldmaking processes.

RENLAM® LY 5210 / REN® HY 5158 is a ready-to-use resin designed for tooling and moldmaking applications. It is compatible with carbon fiber and glass fiber and is ideal for foam molding tools, molds, tools, and vacuum forming tools. The resin offers excellent wetting behavior, heat resistance, long potlife, and room temperature curing, ensuring reliable performance in various moldmaking processes.

RENLAM® LY 5210 / REN® HY 5211 Slow is a ready-to-use resin designed for tooling and moldmaking applications. It offers good adhesion, high-temperature resistance, long potlife, low viscosity, room temperature curing, and excellent heat resistance, making it ideal for tools in industrial processes.

RENLAM® LY 5210 / REN® HY 5212 Fast is a ready-to-use resin designed for tooling and moldmaking applications. Compatible with carbon fiber and glass, it is ideal for composites, lamination, pre-pregs, structural composites, and tools. It offers good adhesion, heat resistance, high-temperature resistance, long potlife, low viscosity, and room temperature curing.

RENLAM® LY 5210 / REN® HY 5213 is a ready-to-use resin designed for equipment and parts, and tooling and moldmaking applications. It is ideal for heat-resistant tools and prepreg tools. The resin offers excellent wetting behavior, heat resistance, long potlife, and room temperature curing, ensuring reliable performance in various industrial and moldmaking processes.

RENLAM® LY 5210 / XB 5173 is a ready-to-use resin designed for tooling and moldmaking applications. It is compatible with carbon fiber and glass, making it ideal for foam molding tools, pre-pregs, tools, and vacuum forming tools. The resin offers excellent heat resistance, long potlife, and very good heat resistance, ensuring reliable performance in demanding industrial processes.

RENLAM® M-1 / ARADUR® HY 177 is a ready-to-use resin designed for devices and assemblies, and parts and components applications. It is ideal for capacitors, filters, and transformers. The resin offers good mechanical properties, thermal stability, low shrinkage, low viscosity, and room temperature curing, ensuring reliable performance in various electronic and electrical components.

RENLAM® M-1 / REN® HY 956 is a ready-to-use resin designed for tooling and moldmaking applications. It is ideal for electrical insulation applications, foundry patterns, and structural composites. The resin offers dimensional stability, excellent mechanical strength, low shrinkage, and low viscosity, ensuring reliable performance in various industrial processes.

RENPASTE® 4666 / REN® 4666 is a paste, ready-to-use resin designed for use with expanded polystyrene (EPS). It offers excellent dimensional stability, machining characteristics, and slump resistance. The resin features a fast cure, good adhesion, low exotherm, low shrinkage, low viscosity, room temperature curing, and superior surface quality, making it ideal for various applications requiring precise performance and high-quality finishes.

REN® HY 5211 Slow / RENGEL® SW 5200 is a gel coat resin epoxy high temperature, speed controlled, gel coat system

REN® HY 5212 Fast / RENGEL® SW 5200 is a gel coat resin epoxy high temperature, speed controlled, gel coat system

TACTIX® 556 is a low moisture, hydrocarbon epoxy novolac resin. These compounds have a dicyclopentadiene backbone with a low average molecular polarity, a feature critical to low moisture absorption. Indeed, the moisture absorption of TACTIX® 556 is considerably lower than that of typical phenolic novolacs such as ARALDITE® EPN 1139 and ARALDITE® EPN 1138 resins. TACTIX® 556 resin shows exceptional ability to retain properties under conditions of moisture and elevated temperature. Additionally, its outstanding properties come with no sacrifice to processability. Similar to Bis-A epoxy resin, TACTIX® 556 resin can be used with a variety of conventional hardeners to optimize specific properties. TACTIX® 556 resin is ideal for new uses where retention of properties under hot and wet conditions is critical.