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EPOCAST® 54-A/B laminating system is an unfilled, solvent-free, easy-to-handle product. It is self-extinguishing and well-suited for the manufacture and repair of composite structures. In addition to laminating applications, the epoxy system can be used for filament winding. EPOCAST® 54-A/B epoxy laminating system is qualified to AIMS 04-27-000-01.

EPOCAST® 88103-A/B casting system is a two-component material that cures at a low temperature. It is formulated to yield a cured polymer with good mechanical, optical, and electrical properties. EPOCAST® 88103-A/B casting system is formulated specifically for the encapsulation of light-emitting diodes. The product is suitable for use in applications that require the environmental protection properties of an epoxy combined with high-efficiency visible light transmission. EPOCAST® 88103-A/B casting system is also widely used as an optical electronic packaging (encapsulant) material.

EPOCAST® 89537-A/B epoxy syntactic is a two-part system with glass-fiber reinforcement that can be troweled or extruded into honeycomb core structures for fastener and attachment potting, core splicing, and edge reinforcing. The syntactic has a non-sag consistency that allows for vertical application up to ½-inch (1.25 cm) thick. EPOCAST® 89537 A/B epoxy syntactic is self-extinguishing and meets the requirements of BMS 5-28 Type 32.

EPOCAST® 938-A3 Epoxy Structural Syntactic Adhesive is a frozen, one-component, flame-retardant compound designed for reinforcing honeycomb structures. EPOCAST® 938-A3 Epoxy Syntactic features high compressive strength at 350°F (177°C). Once thawed, EPOCAST® 938-A3 Syntactic is a thixotropic paste that can be easily dispensed from the cartridge using suitable pneumatic dispensing equipment. EPOCAST® 938-A3 Syntactic is qualified to BMS5-21, Type 1 classes 1; SMS 116201, Type 2; RMS 027, Type X; and others.

Ethylene Diamine (EDA) is the lowest molecular weight ethyleneamine. It contains two primary nitrogens. EDA is a singlecomponent product that is clear and colorless, with an ammonia-like odor.

Ethyleneamine E-100 is a mixture of tetra-ethylene-pent-amine (TEPA), penta-ethylene-hexamine (PEHA), hexa-ethylene-heptamine (HEHA), and higher molecular weight products. E-100 is a complex mixture of various linear, cyclic, and branched products with a number-average molecular weight of 250-300 g/mole.

Ethyleneamine EA-300 is a polyamine mixture of tetraethylenepentamine (TEPA) and higher molecular weight ethyleneamine products. It contains linear, cyclic, and branched products with a number-average molecular weight of approximately 270 g/mole.

GABEPRO™ GPM-800 is a mercaptan (-SH) terminated liquid curing agent that enhances the rapid cure characteristics of epoxy resins when combined with selected amines. It enables quick curing at low temperatures and in thin films, making it suitable for various applications.

GABEPRO™ GPM-800LO Curing Agent is a mercaptan (-SH) terminated liquid curing agent that imparts rapid-cure characteristics to epoxy resins in combination with selected amines. These systems are unique in that they also provide rapid cure rates at low temperatures and in thin films. GPM-800LO is formulated to have an improved odor relative to the standard product.

GABEPRO™ GPM-830 CB is a mercaptan curing agent that enhances bonds between glass and metal, particularly brass and bronze. Ideal for two-component mixing equipment, it is mixed at a 1:1 epoxy/hardener ratio and can serve as a catalyst or co-curing material to improve adhesion.

GABEPRO™ GPM-830 PT is a liquid curing agent used as an industrial additive in various curing processes.

GABEPRO™ GPM-888 Curing Agent is formulated from a mercaptan (-SH) terminated liquid curing agent that imparts rapid-cure characteristics to epoxy resins in combination with selected amines. These systems provide rapid cure rates at low temperatures and in thin films. This material is formulated to cure epoxy resin in approximately 5 minutes.

GABEPRO™ GPM-895 FC hardener is a mercaptan-based epoxy hardener that provides a 40-second gel time when mixed 1:1 with standard bisphenol-A epoxy resin under ambient conditions. It improves bonds between glass and metals such as brass and bronze. Ideal for two-component mixing equipment in assembly line use, it can also function as a catalyst or co-curing agent, imparting typical mercaptan properties with enhanced adhesion.

GABEPRO™ SPI is a liquid curing agent used as a base chemical in various industrial applications.

GABEPRO™ SPI-PM 800 is a liquid curing agent used in chemical manufacturing and industrial applications. As an industrial additive, it enhances the curing process, contributing to the performance and durability of various materials in industrial settings.