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Ethylene Diamine (EDA) is the lowest molecular weight ethyleneamine. It contains two primary nitrogens. EDA is a singlecomponent product that is clear and colorless, with an ammonia-like odor.

Ethyleneamine E-100 is a mixture of tetra-ethylene-pent-amine (TEPA), penta-ethylene-hexamine (PEHA), hexa-ethylene-heptamine (HEHA), and higher molecular weight products. E-100 is a complex mixture of various linear, cyclic, and branched products with a number-average molecular weight of 250-300 g/mole.

Ethyleneamine EA-300 is a polyamine mixture of tetraethylenepentamine (TEPA) and higher molecular weight ethyleneamine products. It contains linear, cyclic, and branched products with a number-average molecular weight of approximately 270 g/mole.

GABEPRO™ GPM-800 is a mercaptan (-SH) terminated liquid curing agent that enhances the rapid cure characteristics of epoxy resins when combined with selected amines. It enables quick curing at low temperatures and in thin films, making it suitable for various applications.

GABEPRO™ GPM-800LO Curing Agent is a mercaptan (-SH) terminated liquid curing agent that imparts rapid-cure characteristics to epoxy resins in combination with selected amines. These systems are unique in that they also provide rapid cure rates at low temperatures and in thin films. GPM-800LO is formulated to have an improved odor relative to the standard product.

GABEPRO™ GPM-830 CB is a mercaptan curing agent that enhances bonds between glass and metal, particularly brass and bronze. Ideal for two-component mixing equipment, it is mixed at a 1:1 epoxy/hardener ratio and can serve as a catalyst or co-curing material to improve adhesion.

GABEPRO™ GPM-830 PT is a liquid curing agent used as an industrial additive in various curing processes.

GABEPRO™ GPM-888 Curing Agent is formulated from a mercaptan (-SH) terminated liquid curing agent that imparts rapid-cure characteristics to epoxy resins in combination with selected amines. These systems provide rapid cure rates at low temperatures and in thin films. This material is formulated to cure epoxy resin in approximately 5 minutes.

GABEPRO™ GPM-895 FC hardener is a mercaptan-based epoxy hardener that provides a 40-second gel time when mixed 1:1 with standard bisphenol-A epoxy resin under ambient conditions. It improves bonds between glass and metals such as brass and bronze. Ideal for two-component mixing equipment in assembly line use, it can also function as a catalyst or co-curing agent, imparting typical mercaptan properties with enhanced adhesion.

GABEPRO™ SPI is a liquid curing agent used as a base chemical in various industrial applications.

GABEPRO™ SPI-PM 800 is a liquid curing agent used in chemical manufacturing and industrial applications. As an industrial additive, it enhances the curing process, contributing to the performance and durability of various materials in industrial settings.

HYPOX® RA 1340 is a high-viscosity adduct of diglycidyl ether of bisphenol A (DGEBA) and butadiene-acrylonitrile (CTBN) elastomer. It enhances toughness, impact resistance, thermal shock, and peel resistance in epoxy formulations, with minimal reduction in thermal resistance and modulus. Compatible with standard epoxy resins and curing agents.

HYPOX® RA840 is a high-viscosity adduct of the diglycidyl ether of bisphenol A (DGEBA) and a butadiene-acrylonitrile (CTBN) elastomer. The elastomer improves the toughness and impact, thermal shock and peel resistance of the epoxy formulation. These improvements are attained with little loss of thermal resistance and modulus. HYPOX® RA840 adduct is suggested for use as a toughener in fiber-reinforced products, adhesives, molding compounds, potting and encapsulating compounds and chemical-resistant coatings. HYPOX® RA840 adduct can be blended with other bis-A epoxy resins to achieve the degree of toughening required.

HYPOX® RA 95 N Resin is a high-viscosity, bisphenol-A epoxy resin toughened with butadiene-acrylonitrile (CTBN) elastomer. It combines epoxy functionality with improved toughness and impact resistance, offering higher temperature performance and better green strength compared to liquid CTBN-based epoxies. Ideal for film adhesives, it provides greater creep resistance at elevated temperatures and is compatible with most standard epoxy resins and curing agents. Cure speed is similar to that of standard liquid bisphenol-A epoxies.

HYPOX® RF1321CB1 resin is an epoxy phenol novolac resin modified with CTBN. The rubber improves the toughness of cured epoxy formulations through development of two phases during cure. Formulations incorporating HYPOX® RF1321CB1 resin will exhibit improvements in impact and thermal cycling resistance, peel and tensile shear strengths and low-temperature mechanical properties compared to non-rubber-modified epoxy formulations. HYPOX® RF1321CB1 resin should be considered for use as the sole resin or as a part of the resin component of your formulation. The optimum concentration of HYPOX® RF1321CB1 resin should be determined empirically. Typical applications generally incorporate 5-15 phr (parts per hundred parts resin) rubber to achieve optimal toughness; higher concentrations improve flexibility.