
- RTU Product Type:2K (2 component) Adhesive, Reactive Adhesive, Structural Adhesive
- Application Area:Cables, Chipboard, Electrical Components, Loudspeaker Membranes, Printed Circuit Boards, Transformers
- Compatible Substrates & Surfaces:Acrylonitrile Butadiene Styrene (ABS), Aluminum, Cellulose, Copper, Copper Alloys, Ferrites, Metal, Paper, Plastics, Polycarbonate (PC), Polyesters, Polyphenylene Ether (PPE), Polystyrene (PS), Polyvinyl Chloride (PVC), Steel, Wood
- Chemical Family:Methacrylates
- Features:Fast Curing, Fast Setting, Good Tensile Properties, Good Thermal Stability, High Peel Strength, Low Viscosity, Moisture Resistant, Room Temperature Curing
AGOMET® F 305 A/B is a low-viscosity, two-component, room-temperature curing, "no mix" methacrylate adhesive suitable for bonding metals and plastics. The high cure rate of this product at room temperature allows it to cure bonded parts in a short time. The adhesive has an assembly time of 1 - 2 minutes, and after 5 minutes, the bonded parts are cured and will reach their final cured strength within 24 hours. Bonds made with AGOMET® F 305 A/B exhibit excellent tensile shear strength, peel strength, as well as excellent moisture and heat resistance.