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Huntsman

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765 Products found on Huntsman  in Electrical & Electronics

AGOMET® F 305 A/B banner
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HuntsmanAGOMET® F 305 A/B
  • RTU Product Type:2K (2 component) Adhesive, Reactive Adhesive, Structural Adhesive
  • Application Area:Cables, Chipboard, Electrical Components, Loudspeaker Membranes, Printed Circuit Boards, Transformers
  • Compatible Substrates & Surfaces:Acrylonitrile Butadiene Styrene (ABS), Aluminum, Cellulose, Copper, Copper Alloys, Ferrites, Metal, Paper, Plastics, Polycarbonate (PC), Polyesters, Polyphenylene Ether (PPE), Polystyrene (PS), Polyvinyl Chloride (PVC), Steel, Wood
  • Chemical Family:Methacrylates
  • Features:Fast Curing, Fast Setting, Good Tensile Properties, Good Thermal Stability, High Peel Strength, Low Viscosity, Moisture Resistant, Room Temperature Curing

AGOMET® F 305 A/B is a low-viscosity, two-component, room-temperature curing, "no mix" methacrylate adhesive suitable for bonding metals and plastics. The high cure rate of this product at room temperature allows it to cure bonded parts in a short time. The adhesive has an assembly time of 1 - 2 minutes, and after 5 minutes, the bonded parts are cured and will reach their final cured strength within 24 hours. Bonds made with AGOMET® F 305 A/B exhibit excellent tensile shear strength, peel strength, as well as excellent moisture and heat resistance.

 

The information, specifications, and materials provided with this product are for general informational purposes only and are subject to change without notice. The product is provided “as is” without any warranties, express or implied, including but not limited to warranties of merchantability, fitness for a particular purpose, or non-infringement. Users are responsible for ensuring the product is suitable for their intended application and for following all applicable safety guidelines and instructions.

The information, specifications, and materials accessible here may not reflect the most current version. Please use the Request a Document feature for the most current product documentation available.

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