Products

E-GRADE® Methyldiethanolamine (E-GRADE® MDEA) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Monomethylethanolamine (E-GRADE® MMEA) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Morpholine is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Morpholinoethanol (E-GRADE® HEM) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Nmethylmorpholine Oxide (E-GRADE® NMMO) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Pentamethyldiethylenetriamine (E-GRADE® PMDETA) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Propylene Carbonate (E-GRADE® PC) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Sulfolane is a liquid processing aid used in automotive and transportation and semiconductor manufacturing applications. It offers effective performance in various industrial processes, providing support in specific chemical and material processing tasks.

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.

E-GRADE® Tetraethylenepentamine (E-GRADE® TEPA) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

E-GRADE® Triethanolamine 75 (E-GRADE® TEA 75) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures, where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application. Huntsman also offers purification services to assist in trace metal reduction for a broad range of amines, including those not manufactured by Huntsman.

E-GRADE® Triethylenetetramine (E-GRADE® TETA) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.

ECA 175 is a curing agent used in paints and coatings, power, water and utilities, and wind energy applications. Compatible with epoxies (EP), it functions as both a curing agent and fabric softener, ensuring effective performance in CASE ingredients.

ELASTAMINE® HE-1000 is used in nylon manufacturing, compatible with fibers and fabrics, and serves as an industrial additive in textile applications.