Products

AGOMET® F 305 A/B is a low-viscosity, two-component, room-temperature curing, "no mix" methacrylate adhesive suitable for bonding metals and plastics. The high cure rate of this product at room temperature allows it to cure bonded parts in a short time. The adhesive has an assembly time of 1 - 2 minutes, and after 5 minutes, the bonded parts are cured and will reach their final cured strength within 24 hours. Bonds made with AGOMET® F 305 A/B exhibit excellent tensile shear strength, peel strength, as well as excellent moisture and heat resistance.

AGOMET® F 307 A/B is a two-component, room-temperature curing, "no-mix" methacrylate adhesive suitable for bonding metals and plastics. Its high setting rate at room temperature allows handling of the bonded parts within a very short time. The adhesive has an assembly time of 3 minutes. As early as 8 minutes after joining (curing at room temperature), the parts can be handled. The final strength is attained within 2 hours. Bonds produced with AGOMET® F 307 A/B have less shrinkage during curing than most other AGOMET® F series.

AGOMET® F 330 / HARDENER Paste is a room-temperature curing methacrylate adhesive suitable for bonding metals and plastics. Its high setting rate at room temperature allows handling of the bonded parts within a very short time. The adhesive has a pot life of approximately 10 minutes. As early as 20 minutes after joining (curing at room temperature), the parts can be handled. The final strength is attained within 2 hours. Bonds produced with AGOMET® F 330 / HARDENER Paste show good tensile shear and peel strengths, as well as good temperature resistance. The product can fill gaps of up to 5mm.

AGOMET® F 330 / HARDENER Powder with hardener powder or hardener paste is a room-temperature curing methacrylate adhesive suitable for bonding metals and plastics. Its high setting rate at room temperature allows handling of the bonded parts within a very short time. The adhesive has a pot life of approximately 10 minutes. As early as 20 minutes after joining (curing at room temperature), the parts can be handled. The final strength is attained within 2 hours. Bonds produced with AGOMET® F 330 / HARDENER Powder show good tensile shear and peel strengths, as well as good temperature resistance. The product can fill gaps of up to 5mm.

ARALDITE® 1258 A/B is a two-component, aluminum-filled paste. The system forms a bond that is often stronger than the materials being bonded. ARALDITE® 1258 A/B conforms to surfaces without heat or pressure and hardens in 2-4 hours at room temperature. Formulated to provide a strong, durable bond when used with a variety of substrates, this adhesive is well-suited for many industrial maintenance applications. It has been approved by the Armed Forces for making emergency repairs in the field.

ARALDITE® 1570 FST A/B is a halogen-free two-component epoxy adhesive. It is designed for aerospace applications that require flame-retardant properties, with its first application being PE foam to phenolic GRP bonding in cargo areas.

ARALDITE® 1641 A/B is an ultra-low-density syntactic designed to have a reduced tendency to crack in high-stress applications. It is available in semkits for easy application and is non-flowing when applied.

ARALDITE® 1644 A/B is a very low-density, room-temperature curing epoxy syntactic designed for edge sealing, void, and gap filling of honeycomb structures. The core filler is characterized by its combination of low density and high compressive strength.

ARALDITE® 2011 A/B is a multipurpose, two-component, room temperature curing, paste adhesive with high strength and toughness. It is suitable for bonding a wide variety of metals, ceramics, glass, rubber, rigid plastics, and most other materials in common use. It is a versatile adhesive for craftsmen as well as most industrial applications.

ARALDITE® 2012 A/B is a rapid cure, multipurpose, two-component, room temperature curing, high-viscosity liquid adhesive with high strength and toughness. It is suitable for bonding a wide variety of metals, ceramics, glass, rubbers, rigid plastics, and most other materials in common use. It is a versatile adhesive for craftsmen as well as most industrial applications.

ARALDITE® 2012-1 Adhesive is a rapid, room-temperature cure multipurpose epoxy adhesive with high strength and toughness. It is a viscous, flowing liquid and can be used to bond a wide variety of metals, ceramics, wood, glass, rubbers, rigid plastics, and other materials in common use.

ARALDITE® 2013-1 A/B is a two-component, room temperature curing paste adhesive with high strength and toughness. It is thixotropic with good environmental and chemical resistance. Although it is designed as a metal bonding adhesive, it is also suitable for bonding other materials such as ceramics, glass, rubbers, rigid plastics, and a wide variety of other materials in common use.

ARALDITE® 2013-2 Adhesive is a two-component, room-temperature curing, paste adhesive of high strength and toughness. It is sag-resistant and offers good environmental and chemical resistance. Although designed primarily for metal bonding, the adhesive is also suitable for bonding other materials such as ceramics, glass, rubbers, rigid plastics, and many other materials in common use.

ARALDITE® 2014 A/B is a two-component, room temperature curing, thixotropic paste adhesive with high strength and excellent chemical resistance. It is used for bonding metals, electronic components, GRP structures, and many other items exposed to higher than normal temperatures or more aggressive environments. Its low outgassing makes it suitable for specialist electronic telecommunications and aerospace applications.

ARALDITE® 2014-1 A/B is a two-component, room-temperature curing paste adhesive. It is thixotropic and offers good environmental corrosion resistance and excellent chemical resistance. It is suitable for bonding metals, electronic components, fiberglass components, and other parts that may encounter high temperatures or harsh environments during use. Due to its low volatility, it can also be used in the special electronic communications and aviation industries.