Products

ARALDITE® 2014 A/B is a two-component, room temperature curing, thixotropic paste adhesive with high strength and excellent chemical resistance. It is used for bonding metals, electronic components, GRP structures, and many other items exposed to higher than normal temperatures or more aggressive environments. Its low outgassing makes it suitable for specialist electronic telecommunications and aerospace applications.

ARALDITE® 2014-1 A/B is a two-component, room-temperature curing paste adhesive. It is thixotropic and offers good environmental corrosion resistance and excellent chemical resistance. It is suitable for bonding metals, electronic components, fiberglass components, and other parts that may encounter high temperatures or harsh environments during use. Due to its low volatility, it can also be used in the special electronic communications and aviation industries.

ARALDITE® 2014-2 A/B is a two-component, room temperature curing, thixotropic paste adhesive of high strength with good environmental and excellent chemical resistance. It is used for bonding metals, electronic components, GRP structures, and many other items where higher-than-normal temperatures or more aggressive environments are encountered in service.

ARALDITE® 2014-3 Adhesive is a two-component, room-temperature curing, sag-resistant paste adhesive with high strength and good environmental and chemical resistance. It can be used for bonding metals, electronic components, composite materials, and many other applications where higher temperatures or aggressive environmental conditions are encountered in service.

ARALDITE® 2015 A/B is a two-component, room-temperature curing paste adhesive that provides a resilient bond. It is thixotropic and non-sagging up to 0.394 inches (10 mm) thickness. It is particularly suitable for SMC and GRP bonding.

ARALDITE® 2015-1 A/B is a two-component, room temperature curing, pale-colored, lightly thixotropic liquid polyurethane adhesive for thermoplastic bonding.

Araldite® 2015-1 L is a two-component room temperature curing, resilient paste adhesive that is thixotropic and anti-sagging up to 10mm thick. It is commonly used for bonding sheet membrane plastics (SMC) and glass fiber reinforced plastics (GRP) materials.

ARALDITE® 2015-2 Adhesive is a high-toughness, two-component, room-temperature curing epoxy paste adhesive providing durable, resilient bonds. It is thixotropic and non-sagging up to 10mm thickness, and is particularly suited for bonding SMC and GRP, as well as bonding dissimilar materials.

ARALDITE® 2018 A/B is a two-component, room temperature curing, pale-colored, lightly thixotropic liquid polyurethane adhesive for thermoplastic bonding.

ARALDITE® 2019 A/B structural adhesive is a two-component, epoxy adhesive paste of high strength and toughness. Performances can be enhanced by post-curing at elevated temperature. It has been designed to perfectly bond onto composites, especially CFRP, but it is suitable for bonding a wide variety of metals, ceramics and many other substrates in common use.

ARALDITE® 2020 A/B is a two-component, room-temperature curing, low-viscosity adhesive specifically designed for glass bonding. It is also suitable for bonding a wide variety of metals, ceramics, rubbers, rigid plastics, and most other materials in common use

ARALDITE® 2020-1 Adhesive is a two-component, room-temperature curing, low-viscosity adhesive designed for glass bonding and applications requiring a transparent adhesive. It is also suitable for bonding a wide variety of metals, ceramics, rubbers, rigid plastics, and many other materials in common use, and may be used for small castings and component potting.

ARALDITE® 2021-1 A/B is a two-component, room temperature curing, methacrylate-based, general-purpose adhesive for rapid assembly operations with a wide variety of substrates.

ARALDITE® 2021-2 A/B is a two-component, room-temperature curing methacrylate general-purpose adhesive for rapid assembly operations on a wide range of substrates.

ARALDITE® 2022-1 A/B is a two-component, room temperature curing, methacrylate adhesive for fast assembly operations on a wide range of substrates, including those which can be “difficult to bond.”