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E-GRADE®
E-GRADE® 3-methyl-2-oxazolidinone (E-GRADE® MEOX)
E-GRADE® 3-methyl-2-oxazolidinone (E-GRADE® MEOX) is primarily used in stripping, cleaning, and wet etching formulations in the semiconductor, display, and PCB industries. Most are water-soluble and contain aminoglycol or polyether structures where both the amine and glycol functions contribute to their performance. The range of primary, secondary, and tertiary amines and structures allows the selection of base strength and corrosion rates based on the needs of the application.
Applications: Batteries, Semiconductor Manufacturing
Product Families: Electronic Chemicals
Chemical Family: Amines
End Uses: ̇Photoresists, Electronics, Semiconductor, Lithium-Ion Batteries, Batteries
E-GRADE®
E-GRADE® THEMAH
E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.
Applications: Printed Circuit Boards (PCBs), Semiconductor Manufacturing
Product Families: Electronic Chemicals
Chemical Family: Chemical Mixtures & Blends
End Uses: Semiconductor, ̇Photoresists, Printed Circuit Boards
TEROL®
TEROL® 518
TEROL® 518 is a modified aromatic polyester polyol.
Applications: Chemical & Industrial Manufacturing, Industrial, Insulation
Product Families: Diols & Polyols
Chemical Family: Polyesters
EPIBOND®
EPIBOND® 315 A/B
EPIBOND® 315 A/B Adhesive is an extrudable, two-component, room-temperature curing epoxy adhesive designed for service temperatures up to 400°F (204°C). This product is suitable for bonding a wide variety of materials, such as metals, composites, and many other dissimilar substrates. The combination of high shear strength and compression makes this adhesive well-suited for aerospace applications and composites requiring a liquid shim. EPIBOND® 315 A/B offers rapid strength build-up with an easy-to-process mix ratio.
Applications: Aerospace & Aviation
Product Families: 2K Liquid Reactive Adhesives, Structural Adhesives
Chemical Family: Epoxy & Epoxy Derivatives
Diethylenetriamine (DETA)
Diethylenetriamine (DETA) is a linear ethyleneamine containing two primary nitrogens and one secondary nitrogen. DETA is a single-component product that is clear and colorless, with an ammonia-like odor.
Applications: Adhesives & Sealants, Agriculture & Feed, Bedding, Building & Construction, Chemical Manufacturing, Electrical & Electronics, Industrial, Oil, Gas & Mining, Other Industrial Applications, Paints & Coatings, Paper & Pulp, Personal Care, Semiconductor Manufacturing, Water Treatment
Product Families: Amines, Functional Additives, Functional Additives
Chemical Family: Amines
End Uses: Hot Melt Adhesive, Coatings, Corrosion Inhibitors, Fabric Softeners, Polyamide Resins, Adhesives, Asphalt Additives, Lubricating Oils, Epoxy Curing Agent, Chelating Agents, Mineral Processing Aids, Textile Additives, Surfactants, Sealants, Fuel Additives, Thermoplastic Polymers
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