Innovative Solutions to Your Biggest Challenges

ARALDITE® 2014-3 Adhesive is a two-component, room-temperature curing, sag-resistant paste adhesive with high strength and good environmental and chemical resistance. It can be used for bonding metals, electronic components, composite materials, and many other applications where higher temperatures or aggressive environmental conditions are encountered in service.

ARALDITE® AV 138 M-2 is a liquid adhesive from the chemical mixtures and blends family. It is ideal for adhesives and sealants markets, particularly in industrial applications, focusing on adhesives and sealants technologies.

TEROL® 518 is a modified aromatic polyester polyol.

ARALDITE® 2015-2 Adhesive is a high-toughness, two-component, room-temperature curing epoxy paste adhesive providing durable, resilient bonds. It is thixotropic and non-sagging up to 10mm thickness, and is particularly suited for bonding SMC and GRP, as well as bonding dissimilar materials.

ARALDITE® 2013-2 Adhesive is a two-component, room-temperature curing, paste adhesive of high strength and toughness. It is sag-resistant and offers good environmental and chemical resistance. Although designed primarily for metal bonding, the adhesive is also suitable for bonding other materials such as ceramics, glass, rubbers, rigid plastics, and many other materials in common use.

E-GRADE® THEMAH provides safer handling alternatives to tetramethylammonium hydroxide (TMAH). Both are strong, metal ion-free organic bases suited for etching silicon and for photoresist developing and stripping applications. In addition, Huntsman has developed a library of many new experimental quaternary ammonium compounds (quats), enabling a range of products for different applications. These are available in aqueous and solvent-based formulations. Huntsman’s platform of TMAH alternatives is being developed with the aspiration of providing less toxic alternatives to TMAH for the next generation of semiconductor cleans.